Global chip leaders meet in New Delhi on 3–4 November
Chip company leaders, researchers and government officials will talk about packaging, testing and power chips.
In short
- The ISIG Executive Summit India 2026 will be held in New Delhi on 3 and 4 November.
- Leaders from chip companies, researchers and government officials will attend.
- Main topics: chip packaging, chip testing, and power chips made with SiC and GaN.
Key numbers
3–4 NovSummit dates
New DelhiVenue city
3Main topics: packaging, testing, power chips
What happened
- The ISIG Executive Summit India 2026 was announced for 3–4 November in New Delhi.
- It brings together chip industry leaders, researchers and policymakers to talk about India's chip ecosystem and supply chains.
- Talks will cover how chips are packaged and tested, and new power chips made with silicon carbide (SiC) and gallium nitride (GaN).
- A senior official from MeitY (the IT ministry) is expected to attend.
Why it matters
Why this is useful
- Meetings like this help companies, colleges and the government plan together.
- Packaging and testing are the first steps where India's new chip plants are starting work.
Why it is good for freshers
- Packaging and power chips are the areas where India's new plants will hire first, so these are good topics to learn now.
- Learn the basics: what a chip package is, how chips are tested (ATE), and why SiC/GaN chips handle high power.
- Follow the summit news on LinkedIn to see which companies are active in India.
Why it is good for India
- Strong packaging and testing skills let India do more of the chip work at home.
- SiC and GaN chips are needed for EVs, solar power and fast chargers, all growing in India.
Fresher jobs related to this story
Words in this story
- Packaging: putting a bare chip into a protective case and connecting it to the outside world.
- SiC / GaN: silicon carbide and gallium nitride, materials for chips that handle high power and heat.
- MeitY: Ministry of Electronics and Information Technology.